Applications

Published Application Notes to download : MicroGeometry,  Solder Paste, Thick Film

Failure analysis

e.g. Automatic measurement of lead coplanarity, spread, form, warpage

Process control

e.g. Thickfilm: Passivation glass layer with resistors

SPC for resistor thickness

Quality assurance

e.g. Waferbumps

Coplanarity evaluation of 9 dies